Of course, with attending organizational meetings, comes potential networking benefits, but more important to me is the wealth of information shared at these meetings. The monthly topics presented by leading experts are fascinating and enlightening. During the December 2012 meeting, Ted Dangelmayer of Dangelmayer Associates and author of two renowned books on establishing a successful ESD management program, presented on the problems of electrostatic discharge to electronic devices. The reliability group members are typically engineers, so the presentations can be quite complex, such as one coming up in February having to do with Photonic Magnetometry to be presented by Chris Sataline from Lincoln Labs MIT, in Lexington MA. Keith Donaldson, Director of the Intercept Technology Group, and I presented a few years ago on the topic How Carbon Footprint, Green Initiatives, and Reliability Can Work Together or Against Each Other” Our presentation was based on a Bell Laboratories, Alcatel-Lucent, environmental impact study for manufacturers. In fact, that white paper is available by request through the Liberty Packaging web site.
Liberty Packaging has been and still is involved with a few other professional groups such as SME (Society of Manufacturing Engineers), NDIA (National Defense Industrial Association), ESDA (Electrostatic Discharge Association) and the afore-mentioned IEEE. For folks looking to furthering their careers and their knowledge, I highly recommend attending and perhaps being involved in a technical association.
Intercept Technology Packaging products fit within a sustainability strategy because they are reusable, recyclable, do not contain or use volatile components (No VOCs, Not a VCI) and leave a smaller carbon footprint than most traditional protective packaging products.